R&D - Engineer (Finance)

TITLE: Manufacturing Process Engineer DEPARTMENT: Package Sensor Solutions Engineering Essential Functions (Responsibilities) Responsible for the development and continuous improvement of manufacturing assembly processes of MEMS pressure sensors Responsible for developing MEMs assembly processes for both production and for engineering prototypes in response to customer design requirements eg wirebonding, die attach, overmolding, encapsulation etc and corresponding materials selection Drive product yield improvement and throughput capacity optimization using Lean Manufacturing and Six Sigma methodologies. Develop, design and introduce improved tooling and /or equipment where appropriate. Develop concepts for flexible assembly and test platforms within the multi-disciplinary Engineering team. Approximately 10% of work conducted in an Class 1000 assembly room environment. Availability to travel in the US and overseas where needed. Qualifications / Requirements Bachelors Degree in Engineering discipline or related field (or high school diploma/GED and 5 years experience as a manufacturing engineer in a semiconductor industry environment) Minimum 2 years engineering experience in high-volume manufacturing. Proven experience of common IC Packaging techniques including wirebonding, die attach, encapsulation techniques, materials selection and micro packaging equipment used in MEMS-based process development. Working knowledge of Design of Experiments (DOE), Failure Mode & Effect Analysis (FMEA), Production Control Plans & Statistical Process Control (SPC). Demonstrated success with automotive or medical product development Ability to work in a clean room environment including wearing required clean room attire and safety equipment. Proficiency in Microsoft office applications (Word, Excel, PowerPoint, Project, Access) For consideration please submit your candidacy online* You must be 18 years or older, willing to take a drug test, submit to a background investigation and have unrestricted authorization to work in the United States.* You must be willing to work out of an office located in Fremont, CA.* If currently an Amphenol employee, you must have been in your current position for at least 12 months and have at least a satisfactory performance rating (e.g. Highly Valued) Desired Six Sigma Quality Experience (Green Belt Certified) Experience with workstation layout & design and ergonomic principles. Experience working with new product introduction and project management. Experience with Integrated Circuit manufacturing and assembly techniques. Strong written communication skills - able to write clear and concise reports. Strong verbal communication skills - ability to communicate effectively with employees at all levels of the organization. Excellent team player with proven record of working across multiple projects and teams Capable of working with internal and external teams Knowledge of MEMS products and processes Experience working with MEMS and/or pressure sensor testing techniques. Strong team player - demonstrated ability to work within a team and drive results. Self-motivated with the ability to meet strict deadlines. General NovaSensor, an affiliate of Amphenol Sensors, offers a growth orientated, fast paced opportunity with a comprehensive benefit program. NovaSensor is an affirmative action employer. Please contact Katrina Manners at Katrina.manners@amphenol-sensors.com for more informat